A new technical paper titled “Scaling of Two-Dimensional Semiconductor Nanoribbons for High-Performance Electronics” was ...
A new technical paper titled “The Quest for Reliable AI Accelerators: Cross-Layer Evaluation and Design Optimization” was ...
AI squeezes consumer memory market; 3D-IC basics, challenges; atomistic simulation; GPUs and auto security; AI-assisted ...
AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge ...
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