This work presents the imprint-thorough mold via (i-TMV) concept applicable for compartmental level electromagnetic interference (EMI) shielding. The i-TMV structure could be successfully fabricated ...

Product security and reliability are major concerns in the semiconductor and PCB fabrication industries. Because of this, ...

Long-term stability of the MoS2 film grown via atmospheric pressure chemical vapor deposition (APCVD) on Si/SiO2 substrates is important for its practical applications in electronics and ...

Due to the complex parameters of antireflective subwavelength structures (ASS) and the limitations of Gaussian beam manufacturing, fabricating ASS with ultrahigh transmittance directly on ZnS infrared ...

With recent advancement and progress in the field of 3-D integration for modern high-speed and high-bandwidth electronic systems, there is an ever-increasing demand for high-quality through-silicon ...