Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

What to do? Build an interposer, of course. You can bring the module up to date by sending some extra init commands to the GPS chipset during bootup, and, firmware hacking just wasn’t the route.

The diagram in the slide shows an HBF stack, which consists of multiple HBF core dies connected via TSV (Through-Silicon ... The entire stack sits on an interposer atop a package substrate ...

The TSV connections from top to bottom of the interposer make it a versatile and efficient packaging system. Silicon interposers have a variety of advantages over printed Circuit Board (PCB) ...

The interposer already has been tested by the supplier ... In the process of qualifying a TSV vendor we ran a lot of experiments, and one of these was to see the quality of TSVs. In order to test ...