Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging ...

A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

Timely engineering fixes rely on high-speed communications standards, but data inconsistencies are getting in the way.

pkg is built on top of libpkg, a new library to interface with the package registration backends. It abstracts package management details such as registration, remote repositories, package creation, ...

You can go to the store tab and check for it. Now, once you reach the next XP level on your account, you will see the “Weekly Care Package” pop-up right after the game. Alternatively, if you missed ...

The "Bad to the Bone" singer shares insights on his iconic hits, performing at the Paramount, and thoughts on turning 75.

This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...

A Key Part of High-Performance Compute: Summary Heterogeneous integration and AI are advancing together, driving high-performance computing with m ...