Semiconductor Engineering6d
Speeding Down Memory Lane With Custom HBM
Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.
Design-Reuse15d
Rapid Physical Prototyping of Microelectronic Systems Based on Incompatible Technologies (The case for silicon interposers)
The TSV connections from top to bottom of the interposer make it a versatile and efficient packaging system. Silicon interposers have a variety of advantages over printed Circuit Board (PCB) ...
Dataweek18d
The successful development of PCBWay’s 24-layer, 6-order arbitrary interconnection HDI PCB
Secondly, interposer PCB technology addresses signal integrity and power consumption issues. By utilising interposer technology, signal pins can be directly connected to the interposer layer, reducing ...