TI unveils the first 48-V integrated hot-swap eFuse and a new family of integrated GaN power stages in TOLL packaging.

Demand for advanced semiconductor foundry capacity will remain at an all-time high in 2025. Many leading industry analyst ...

The first shipments are Gen 2 650V, 40A devices in a TO-247 package with a co-packed diode.

With their low current consumption over a wider voltage range in a compact package, the Vishay Semiconductors VSOP383xx ...

Featuring a SiC primary power switch, this 1,700-V flyback switcher IC is now available in low-creepage, automotive-grade ...

Power Integrations (NASDAQ: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, ...

G networking links and interfaces are in the commercialization stage, and 224G implementations for the data center are not ...

With Microsoft Visual Studio, you can create a NuGet package from a .NET class library, and then publish it to nuget.org using a CLI tool. The quickstart is for Windows users only. If you're using a ...

HONOR shipped out a review unit of the Watch 5 Ultra for us to check out, roughly two weeks ahead of their announcement at MWC. We’ve been using this device for around 2 weeks before writing ...

Figure 2. POP laminated package. Epoxy flux in the POP laminated package application has the following advantages: 1. High-precision positioning: it effectively prevents the top component from ...