TI unveils the first 48-V integrated hot-swap eFuse and a new family of integrated GaN power stages in TOLL packaging.

Demand for advanced semiconductor foundry capacity will remain at an all-time high in 2025. Many leading industry analyst ...

The first shipments are Gen 2 650V, 40A devices in a TO-247 package with a co-packed diode.

Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, ...