Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging ...

A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

pkg is built on top of libpkg, a new library to interface with the package registration backends. It abstracts package management details such as registration, remote repositories, package creation, ...

You can go to the store tab and check for it. Now, once you reach the next XP level on your account, you will see the “Weekly Care Package” pop-up right after the game. Alternatively, if you missed ...

The eight-city tour kicks off in Los Angeles on April 28.

This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...