V is emerging as the new standard for automotive power. But Molex warns that bridging the gap between current 12-V and future ...

The Moon and asteroids are at the top of the mission list for a number of agencies, while others will focus on exploration to ...

A software companion to BridgeSwitch motor-driver ICs controls and configures high-efficiency single- and three-phase BLDC ...

Electronic Design’s readers have spoken. We present the top analog articles of 2024, as well as invite you, our readers, to ...

Advances in materials science stemming from research in South Korea are leading to higher-performance piezoelectric and ...

SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power ...

Inside the latest 16-phase power controller from Alpha and Omega Semiconductor and how it helps feed power-hungry GPUs and ...

Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

The AMD unified shader architecture that debuted in the Xbox 360 ushered in a new era for the graphics processing unit (GPU).

CHIPS Act spurred a renaissance moment in the semiconductor industry, threatening to be upended by a significant skills gap.

An eFPGA is an FPGA that’s embedded into an ASIC to provide one or more programmable-logic fabrics for flexibility and ...