Software-defined products and custom silicon; finFET stress deformation; testing AI data center networks; European ...

How to put the pieces together in a complex design with AI is an unsolved problem.

The semiconductor industry is undergoing a fundamental shift from monolithic chip designs to chiplet-based architectures.

A new technical paper titled “Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors” was ...

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at ...

The researchers used it to map stray magnetic fields from CoFeB–SiO2 thin films used in high-frequency inductors. They ...

PMJ 2025 was more than just a successful event—it was a clear signal that the photomask and eBeam communities are growing, ...

New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.

Data centers and cloud computing need multi-core and multi-socket scalability. And while the basic building blocks can be ...

A new technical paper titled “What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips” was ...

Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; ...

A new technical paper titled “Josephson Junctions in the Age of Quantum Discovery” was published by researchers at Lawrence ...