Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...

Processing and packaging have long been treated as two different worlds, walled off from each other by the obvious differences in the two functions. However, a growing number of industry professionals ...

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. Ever since former Intel CEO Pat Gelsinger announced in 2021 that Intel was entering the ...