The fifth article in a six-part series looks at expanding the use of western tree species to improve wood substrate supply ...
KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei Co., Ltd. (TOKYO: 7282), together with Osaka University, has succeeded in increasing the diameter of substrates for gallium nitride (GaN) power devices 1.
Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...
The Global Electronics Association has published a new international standard, IPC‑6921, establishing formal requirements and acceptance criteria for organic integrated circuit (IC) substrates used in ...
Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...
Traditionally employed to make light-emitting diodes (LEDs), sapphire substrates now are being used by Apple Inc. and other smartphone makers as covers for camera lenses and home buttons, contributing ...
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