Mena FN

Silicon Genesis Extends Its NANOCLEAVETM Layer Transfer Process For 3DIC Integration To Interconnect Network Layers

Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...
Morningstar

Socionext Expands 3DIC Support with Advanced 3D Die Stacking and 5.5D in Packaging Portfolio

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...
abc27

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE(TM) Layer Transfer Process

SiGen has been actively developing 3DIC process technology for over seven years including several applications for CMOS Image Sensors (CIS). This promising development has the potential for ...
WTNH

Silicon Genesis extends its NANOCLEAVE™ Layer Transfer Process for 3DIC Integration to Interconnect Network Layers

Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...
KLFY News 10

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE(TM) Layer Transfer Process

SIGen Enhances CMOS Performance by 3DIC Wafer Scale Stacking Using Proprietary NANOCLEAVE (TM) Layer Transfer Process News provided by EIN Presswire Mar 02, 2023, 9:00 PM ET SiGen Extends Application ...